润湿性测试仪（SP-2）
是一款采用了SP张力法（曲线升温法）的用于表面实装中锡膏、部品电极、打印基板的润湿性试验器。
可实行润湿平衡法、米克隆润湿平衡法、急加热升温法的测定。（选配）
三种测量方法可选
观察测量状态
特点
- ●最适于关于无铅焊锡的润湿性评价（锡膏、部品、温度条件）。
- ●可通过玻璃窗口观察润湿的全过程。
- ●可实行润湿平衡法、米克隆润湿平衡法、急加热升温法的测定。（选配）
- ●可以实现与实际的回流工程相同或最适合其的温度曲线。＜搭载预热机能、内藏有强力的加热器＞
- ●可对1005及0603等大小的微小芯片部件的润湿性进行评价测试。 ＜采用电平衡传感器、可以检测出极其微小的力＞
- ●使用电脑（专用软件）对设定条件、测定操作、润湿时间、润湿力等结果数据进行自动解析。
- ●也可对丝线焊锡进行评价试验。
product specification
| Item | Specifications | |
| Load Sensor | Principle | Electro - balance sensor |
| Measurement range | 10.00gf～－5.00gf | |
| Measurement accuracy * | ± (10mgf + 1 digit) | |
| Resolution | Less than 900 mgf: 0.001 gf More than 900 mgf: 0.005 gf | |
| Temp. Sensor | Measurement range | 0～300℃ |
| Measurement accuracy | ±3℃ | |
| Heater unit | Temp. of heater unit | Room temperature ～ 300℃ |
| O2 Concentration | Simple closed heater unit with nipple for N2 purge test | |
| Temp. profile setting |
1. Preheat temp. 2. Preheat time 3. The rate of temp. rise 3℃ /sec. (standard) 4. Maximum temp. 5. Maximum temp. time |
|
| Melting point | Preset solder paste melting point | |
| Table movement |
Automatic: operated by PC Manual: operated by Up/Down switch (selectable 3 steps speed) |
|
| Digital output | RS-232C cable (Malcom format) | |
| Air supply | Original air pressure: 0.2～0.5 Mpa (Approx. 2～5 kgf / cm2) Adjustment air: 0.2 Mpa (Approx. 2kgf / cm2 ) | |
| Power supply | AC100V 50 / 60Hz 700W | |
| Weight | Approx. 20kg | |
- *Load sensor accuracy is not concerned oscillation.
